光电融合集成技术是突破后摩尔时代算力、通信速率与能耗瓶颈的关键，具有重大战略价值。它结合光子的高带宽、低损耗传输与电子的高精度计算、存储优势，在光通信、国防、人工智能和智能感知等领域展现出巨大潜力。然而，该技术面临材料兼容性、光场多维度调控、设计理论与工艺平台等多方面的挑战。

 全球竞争激烈，美国通过DARPA的“电子复兴计划”等战略布局，引领光电融合创新，其产业界如Intel在高速SerDes和星地激光通信方面取得显著成果。欧洲通过“地平线计划”支持光子产业发展，日本长期投入光电融合系统技术，NTT 公司实现了1.2Tb/s相干光模块。全球工艺平台呈现高校科研平台、国家级研发中心和领先企业自建平台的三级梯队格局。 

我国在该领域起步较晚但发展迅猛，部分方向已达到国际先进水平。国家信息光电子创新中心实现了100G-400G硅光收发芯片产业化，清华大学研发的光电融合芯片ACCEL能效显著提升，航天504所实现了10Gbps星地激光通信。但我国仍面临工艺平台分散、加工能力与国际领先水平存在差距、核心设计软件缺失、封装标准和规模化制造能力不足以及系统级应用需加强等挑战。 

针对以上情况，本报告提出以下发展建议：在芯片层面，重点突破硅基中红外光电集成、光电超大规模异质异构集成芯片、多功能多通道可重构微波光子芯片以及光子智能芯片；在系统与应用层面，布局感算一体的高精度多维感知成像技术、空间激光骨干通信组网技术、超大容量超低功耗光通信芯片与模块、多芯粒光计算/传感系统、共封装集成与高速片间光I/O技术，以及统一的光电融合集成工艺平台技术；在政策与机制层面，建议启动国家自然科学基金委“光电融合集成重大研究计划”，加强体系化基础研究，加大核心工艺研发投入，健全产业生态链，建立标准化体系，推动一体化协同发展。 

光电融合集成技术是未来信息技术竞争的战略制高点。亟需在国家层面进行顶层设计和资源统筹，打通全链条，构建自主可控的创新生态，实现“光-电-算”一体化突破，支撑我国信息科技领域的全面跃升。

Photonics-electronics convergence and integration (PECI) technology represents a pivotal breakthrough in addressing the limitations of computing power, communication speed, and energy consumption in the post-Moore era, holding significant strategic value. By integrating the high bandwidth and low-loss transmission of photons with the high-precision computing and storage capabilities of electrons, this technology has demonstrated substantial potential across various fields, including optical communication, defense, artificial intelligence, and intelligent perception. However, it confronts multifaceted challenges related to material compatibility, multidimensional tuning mechanisms of optical fields, design theories, and process platforms.

The global competition in this domain is intense. The United States, through strategic initiatives such as DARPA's "Electronics Resurgence Initiative", has taken the lead in photonic-electronic convergence innovation, with its industry, exemplified by Intel, achieving remarkable results in high-speed SerDes and satellite-to-ground laser communication. Europe has supported the development of the photonics industry through the Horizon program, while Japan has made long-term investments in PECI system technology, with NTT realizing a 1.2Tb/s coherent optical module. The global process platform is characterized by a three-tier structure, comprising university research platforms, national research and development centers, and leading enterprisebuilt platforms.

China, although a latecomer in this field, has experienced rapid development and has reached international advanced levels in some areas. The National Information Optoelectronics Innovation Center has achieved industrialization of 100G-400G silicon photonics transceiver chips. Tsinghua University has developed the photonic-electronic convergence chip ACCEL, which has significantly improved energy efficiency. The 504th China Academy of space technology has realized 10Gbps satellite-to-ground laser communication. However, China still faces challenges such as a fragmented process platform, processing capabilities lagging behind international leading levels, alack of core design software, insufficient packaging standards and large-scale manufacturing capabilities, and the need to strengthen system-level applications.

In light of the above, this report proposes the following development suggestions: at the chip level, focus on breaking through silicon-based mid-infrared photonicelectronic integration, ultra-large-scale heterogeneous photonic-electronic integration chips, multi-functional and multi-channel reconfigurable microwave photonic chips, and photonic intelligent chips. At the system and application level, deploy integrated sensing and computing technology for high-precision multi-dimensional perception imaging, spatial laser backbone communication networking technology, microwave photonic broadband intelligent precision guidance technology, ultra-large capacity and ultra-low power optical communication chips and modules, multi-chiplet optical computing/sensing system, co-packaged integration and high-speed chip-to-chip optical I/O technology, and unified process platform technology for PECI. At the policy and mechanism level, it is recommended to launch the " Major Research Plan for Photonics-Electronics Convergence and Integration " under the National Natural Science Foundation of China to strengthen systematic research on PECI, increase R&D investment in core processes, improve the industrial ecosystem, establish a standardization system, and promote integrated and coordinated development.

PECI technology is a strategic high ground in future information technology competition. There is an urgent need for top-level design and resource integration at the national level to break through the entire chain, build an independent and controllable innovation ecosystem, achieve integrated breakthroughs in "light-electricitycomputation" and support comprehensive advancements in China's information technology field.